Chipmassgehäuse für eine Lichtemittierende Vorrichtung und Herstellungsverfahren davon

Details

Veröffentlichungs-Nr.

EP3188261

Aktenzeichen

EP16206749

Anmeldetag

23. Dezember 2016

Veröffentlichung

24. April 2024

Erteilung

24. April 2024

Rechtsraum

EP

IPC

H01L33/50H01L33/54H01L33/56H01L33/48H01L33/00// H01L33/58

Abstract

A Chip-Scale Packaging (CSP) LED device (1A) and a method of manufacturing the same are disclosed. The CSP LED device (1A) includes a flip-chip LED semiconductor die (10) and a packaging structure (200), wherein the packaging structure (200) comprises a soft buffer layer (20), a photoluminescent structure (30) and an encapsulant structure (40). The soft buffer layer (20) includes a top portion (21) formed on top of the flip-chip LED semiconductor die (10), and an edge portion (22) formed covering an edge surface (13) of the flip-chip LED semiconductor die (10), wherein the top portion (21) has a convex surface (211), and the edge portion (22) has an extension surface (221) smoothly adjoining the convex surface (211). The photoluminescent structure (30) is formed on the soft buffer layer (20) covering the convex surface (211) and the extension surface (221) of the soft buffer layer (20). The encapsulant structure (40), which has a hardness not lower than that of the buffer layer (20), is formed on the photoluminescent structure (30). Therefore, the CSP LED device (1A) has improved reliability by improving adhesion strength between the flip-chip LED semiconductor die (10) and the packaging structure (200), and improved optical performance such as more consistent correlated color temperature (CCT), more uniform spatial color, and higher optical efficacy.

Anmelder

Firma

Maven Optronics Co., Ltd.

Land

🇹🇼 Taiwan

Fachgebiete