Lichtemittierende Vorrichtungsverpackung

Details

Veröffentlichungs-Nr.

EP3200249

Aktenzeichen

EP17152960

Anmeldetag

25. Januar 2017

Veröffentlichung

17. Juni 2020

Erteilung

17. Juni 2020

Rechtsraum

EP

IPC

H01L33/48H01L33/62// H01L33/64

Abstract

A light emitting device package includes a body having first to sixth side surface parts and a cavity on the first side surface part; first and second lead frames on a bottom of the cavity; and a light emitting chip on at least one of the first and second lead frames. The first and second lead frames have first and second bonding parts on first and second outer side areas of the body and a first heat and second radiating parts bent from the first and second bonding parts. The first and second recesses include an upper area inclined at a first angle and a lower areas inclined at a second angle from the upper area and the second angle is smaller than the first angle, and the first and second heat radiating parts of the first and second lead frames are disposed on the lower areas.

Anmelder

Firma

LG Innotek Co., Ltd.

Land

🇰🇷 Südkorea

Fachgebiete