Verfahren und Vorrichtung zur Schätzung eines Schadens oder einer Lebenserwartung eines Leistungshalbleitermoduls

Details

Veröffentlichungs-Nr.

EP3203250

Aktenzeichen

EP16154094

Anmeldetag

3. Februar 2016

Veröffentlichung

24. Mai 2023

Erteilung

24. Mai 2023

Rechtsraum

EP

IPC

G01K1/02G01K7/42G01R31/26G01R31/28

Abstract

The present invention concerns a method and a device for estimating a level of damage or a lifetime expectation of a power semiconductor module comprising at least one die that is mechanically, thermally, and electrically attached to a substrate, composed of plural layers of different materials. The invention: - obtains power losses of the power semiconductor module, - obtains the temperature in at least two different locations of the power semiconductor module, - estimates a thermal model between the at least two different locations of the power semiconductor module using the determined power losses and the obtained temperatures, - determines if a notification indicating the level of damage or the lifetime expectation has to be performed according to the estimated thermal model and a reference thermal model. - notifies the level and location of damage or the lifetime expectation if the determining step determines that the notification has to be performed.

Anmelder

Firmen

Mitsubishi Electric R&D Centre Europe B.V.
Mitsubishi Electric Corporation

Land

🇳🇱 Niederlande

Fachgebiete