Verfahren zur Herstellen eines Lichtemittierenden Moduls und Lichtemittierendes Modul
Anmelder: NICHIA CORPORATION 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP3364458
- Aktenzeichen
- EP18156901
- Anmeldetag
- 15. Februar 2018
- Veröffentlichung
- 22. März 2023
- Erteilung
- 22. März 2023
- Rechtsraum
- EP
- IPC
- H01L25/075G02F1/13357// H01L33/50H01L33/60
Abstract
A light emitting module with a reduced thickness is provided. A method of manufacturing a light emitting module sequentially includes: providing a light guiding plate having a first main surface being a light emitting surface, and a second main surface on the side opposite to the first main surface; providing a plurality of light emitting elements on the light guiding plate; and forming a wiring electrically connecting the plurality of light emitting elements. A light emitting module includes: a light guiding plate having a first main surface and a second main surface; a plurality of wavelength conversion parts disposed at the second main surface of the light guiding plate so as to be spaced apart from each other; a plurality of light emitting elements respectively bonded to the plurality of wavelength conversion parts; and a wiring connected to the plurality of light emitting elements.
Anmelder
- Firma
- NICHIA CORPORATION
- Land
- 🇯🇵 Japan
Japanischer Hersteller von LEDs und Halbleiterbauelementen, bekannt als Erfinder der ersten hocheffizienten blauen Leuchtdiode.
387 Patente in unserer Datenbank
Vertreten von
-
Eisenführ Speiser
Eisenführ Speiser · München