3D-Verpackungsverfahren für Halbleiterbauelemente

Details

Veröffentlichungs-Nr.

EP3422395

Aktenzeichen

EP17178490

Anmeldetag

28. Juni 2017

Veröffentlichung

8. Juni 2022

Erteilung

8. Juni 2022

Rechtsraum

EP

IPC

H01L21/58H01L21/48// H01L21/60H01L23/488

Abstract

According to the method of the invention, a semiconductor component comprising microbumps (5) on a planar bonding surface is prepared for bonding by applying a photosensitive polymer layer (6) on the bonding surface. The average thickness of the initial polymer layer (6) in between the microbumps is similar to the average height of the microbumps (5). This is followed by a lithography-step wherein the polymer is removed from the upper surface of the microbumps and from areas (10,11) around microbumps. This is followed by heating to a temperature at which the polymer flows, resulting in a polymer layer (7) that closely adjoins the microbumps, without exceeding the microbump height. The closely adjoining polymer layer (7) has a sufficient degree of planarity to make it equivalent to a planarized layer obtainable by prior art methods. The invention is equally related to a method for bonding the thus prepare component..

Anmelder

Firma

IMEC vzw

Land

🇧🇪 Belgien

Fachgebiete