Verpackung und Verfahren zur Herstellung einer Verpackung mit einem Gehäuse und einer Integrierten Schaltung

Details

Veröffentlichungs-Nr.

EP3454370

Aktenzeichen

EP17190462

Anmeldetag

11. September 2017

Veröffentlichung

9. September 2020

Erteilung

9. September 2020

Rechtsraum

EP

IPC

H01L25/16H01L33/64H01S5/024

Abstract

There is disclosed a method of manufacturing an enclosure for an integrated circuit having at least one optical component and at least one electronic component, the method comprising the steps of providing at least one thermal contact connected to at least one of the components, and forming a heat sink that is integral with the enclosure, wherein the at least one thermal contact comprises electrically and thermally conductive metal suitable for transferring heat from the at least one component to the heat sink. There is also disclosed a package comprising an enclosure and an integrated circuit.

Anmelder

Firma

Nokia Technologies Oy

Land

🇫🇮 Finnland

Fachgebiete