Verfahren zur Herstellung eines Metall-Keramik-Substrats mit Getrimmten Widerständen sowie Metall-Keramik-Substrat mit Getrimmten Widerständen

Details

Veröffentlichungs-Nr.

EP3456698

Aktenzeichen

EP17190803

Anmeldetag

13. September 2017

Veröffentlichung

16. November 2022

Erteilung

16. November 2022

Rechtsraum

EP

IPC

C04B37/02B23K26/0622B23K26/351H01L49/02H01C17/242B23K26/03H05K3/02H05K1/16H05K1/03H05K1/02B23K26/00B23K26/082B23K26/361B23K26/40B23K101/38B23K103/12

Abstract

The invention relates to a method for manufacturing a metal-ceramic substrate (10), including providing a central ceramic insulation layer (20) with a conductive metal layer (30) on one or both of its surfaces. Laser ablation with an ultrashort pulse laser is performed on at least one conductive metal layer (30) locally within an ablation area (31) until a certain resistivity of the conductive metal layer (30) is achieved in this ablation area (31). Thereby, the thickness of the conductive metal layer (30) in the ablation area (31) is reduced to a value above zero so that certain resistance values can be achieved in order to form resistors on the metal-ceramic substrate (10). The invention also relates to a corresponding metal-ceramic substrate which has been manufactured by such method. In particular, the conductive metal layer (30) is made of copper which is applied to the central ceramic layer (20) by means of a DCB process to form a DCB substrate.

Anmelder

Firma

Infineon Technologies AG

Land

🇩🇪 Deutschland

Fachgebiete