Reduzierung von Vibration einer Mems Installation auf einer Leiterplatte

Details

Veröffentlichungs-Nr.

EP3470366

Aktenzeichen

EP18196462

Anmeldetag

25. September 2018

Veröffentlichung

8. Juli 2020

Erteilung

8. Juli 2020

Rechtsraum

EP

IPC

B81B7/00G01P1/02

Abstract

The present invention relates to a method for installing a MEMS component package on a PCB and to an installation comprising a PCB with a MEMS component package installed on it achieved with the method. the MEMS component package comprises a body having outer surfaces of electrically non-conductive material and a plurality of electrically conducting leads protruding from the body. At least one solder pad is applied on at least one blind pad exposed on a PCB surface simultaneously with applying solder paste for electrically joining the leads to the PCB to pin pads. The at least one blind pad disposed at a location collocated with an intended location of the body, and the at least one solder pad is collocated with the at least one blind pad. The MEMS component package is placed on the PCB surface, joining the leads temporarily to the pin pads of the printed circuit board with solder paste. In a reflow process, the PCB is subjected to controlled heat configured melt the solder paste. This electrically couples the leads to the pin pads, and simultaneously melts the at least one solder pad. The melting is configured to transform the at least one solder pad into a solder bump configured to couple the body to the at least one blind pad. The solder bump attaches with a non-galvanic contact directly to the electrically non-conductive plastic bottom of the body.

Anmelder

Firma

Murata Manufacturing Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete