Boco IP Oy Ab

The disclosure relates to a microelectromechanical system comprising an ASIC layer, an interposer layer, a MEMS layer with movable structures and a cap layer stacked with each other in a listed order. The interposer layer and the cap layer form one isolated enclosure, and the ASIC layer and the cap layer form another isolated enclosure, wherein pressures in the isolated enclosures are different. An advantage of the arrangement of the disclosure is that it allows to set different pressures in the isolated enclosures reliably without extra process steps.

The disclosure relates to microelectromechanical (MEMS) devices. The MEMS device comprises an ASIC layer, a MEMS device layer and a cap layer and bonding layers therebetween form an enclosure for movable MEMS elements. The MEMS device layer and the cap layer comprise at least one ASIC signal through-silicon-via that electrically connects signals of an ASIC active circuitry the respective metal pad on the outer face of the cap layer.

The disclosure relates to microelectromechanical system comprising an ASIC layer, a handle layer, a device layer and a cap layer vertically attached to each other in a given order. The device layer is electrically connected to the ASIC layer through the handle layer.

A microelectromechanical device comprises a MEMS device layer a handle layer and a cap layer. The device also comprises an interposer layer between the handle layer and the MEMS device layer. The interposer layer comprises an insulating layer on the surface of the handle layer and a polysilicon layer on the insulating layer. The device layer comprises a mobile mass element. The polysilicon layer lies beneath the mass element and is electrically connected to a first external contact in the cap layer through the device layer.

The disclosure relates to a microelectromechanical (MEMS) device and to a method of manufacturing a MEMS device. The MEMS device comprises a a cap layer, two MEMS device layers and an ASIC layer, while the cap layer and the ASIC layer enclose functional elements of the two MEMS device layers in an enclosure. Digital signals, ground and operating voltage of ASIC circuitry are coupled with outside of the MEMS device through one or more ASIC signal through-silicon-vias traveling through the two MEMS device layers and the cap layer.

The invention relates to a railway vehicle (1) with a variable gauge bogie system (2). At least one of the wheels (3, 3') of the bogie system (2) is arranged slidably along its axis (4) by means of a slide joint (6). The variable gauge bogie system (2) comprises a locking means (7) allowing or preventing the sliding of the at least one wheel (3, 3') by means of the slide joint (6). To adapted the railway vehicle (1) for operation in freezing conditions, it further comprises an electric heating system (8) for selectively heating at least one of the slide joint (6) and the locking means (7), the electric heating system (8) comprising an electric power source (9) and at least one heating element (10) arranged adjacent to the slide joint (6) or the locking means (7) and electrically connecting to the electric power source (9).

The disclosure relates to a aspects of a method for manufacturing electronic and/or microelectromechanical system, MEMS, devices using a lid frame that carries a plurality of such devices. Use of the lid frame enables performing manufacturing steps as well as testing and/or calibration of devices packaged into individually produced housings with manufacturing, testing and calibration equipment that is designed to handle lead frames.

Presented is a pod propulsion unit 1 comprising a housing (2), a support arm (3), a propeller shaft (5) that is rotatable supported within the housing by means of at least a first bearing arrangement (6) having a first bearing housing (7), first fastening means (11) for fastening the first bearing housing (7) to the housing (2). The first bearing housing (7) and the housing (2) are spaced apart from one another by means of a first electrical insulation arrangement (13) arranged between the first bearing housing (7) and the housing (2) and configured to electrically insulate the first bearing housing (7) from the housing (2). The first electrical insulation arrangement (13) comprising first ceramic insulators (42), and the first ceramic insulators (42) contacting the first bearing housing (7) and the housing (2) so as to space apart the first bearing housing (7) and the housing (2) from one another.

The disclosure describes an arrangement comprising a spring-supported tiltable hermetic housing structure with an optical window and single-axis scanning mirror inside the housing structure. The arrangement enables the use of the resonance scanning mode of the mirror in vacuum, inside the housing structure, as well as the quasistatic scanning mode of the mirror by oscillating the housing structure in ambient pressure.

An accelerometer which comprises a first, second, third and fourth measurement cell. Each of the first, second, third and fourth measurement cells comprises a mass element which is mobile in the y-direction and first and second fixed structures. The mass element forms a differential capacitor with the first and second fixed structures. Each of the first, second, third and fourth measurement cells comprises a central line, and the first and second fixed structures are on opposite sides of the central line in each of the first, second, third and fourth measurement cells. The placement of the first and second capacitors with respect to the central line in the first and third measurement cells is the same. The placement of the first and second capacitors with respect to the central line in the second and fourth measurement cells is the same. The placement of the first and second capacitors with respect to the central line in the first measurement cell is opposite to the placement of the first and second capacitors with respect to the central line in the second measurement cell.