Einbettung einer Komponente in einen Komponententräger durch Übertragung der Komponente in einen Bereits mit Füllmaterial Gefüllten Hohlraum

Details

Veröffentlichungs-Nr.

EP3474639

Aktenzeichen

EP17197559

Anmeldetag

20. Oktober 2017

Veröffentlichung

14. Juli 2021

Erteilung

14. Juli 2021

Rechtsraum

EP

IPC

H05K1/18H01L23/538// H05K1/02H05K3/46

Abstract

Described is a method for manufacturing a component carrier (160) having an embedded component (120). The method comprises providing a support structure (100); attaching an electronic component (120) at a surface of the support structure (100); providing a core structure (130); forming a cavity (130a) within the core structure (130); partially filling the cavity (130a) with a predefined amount of filling material (140); positioning the support structure (100) relative to the core structure (130) in such a manner that the electronic component (120) is transferred into the cavity (130a) and is dipped into the filling material (140); curing the filling material (140) such that the component (120) within the cavity (130a) is fixed to core structure (130); and removing the support structure (100).

Anmelder

Firma

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Land

🇦🇹 Österreich

Fachgebiete