Paketantenne mit Besserer Antennenleistung

Details

Veröffentlichungs-Nr.

EP3477767

Aktenzeichen

EP18200638

Anmeldetag

16. Oktober 2018

Veröffentlichung

10. März 2021

Erteilung

10. März 2021

Rechtsraum

EP

IPC

H01Q1/22H01Q1/48H01Q1/52H01Q9/26H01Q21/06H01Q21/12

Abstract

An Antenna-in-Package (AiP) includes an interface layer, an integrated circuit die disposed on the interface layer, a molding compound disposed on the interface layer and encapsulating the integrated circuit die, and a plurality of solder balls disposed on a bottom surface of the interface layer. The interface layer includes an antenna layer, and an insulating layer between the antenna layer and the ground reflector layer. The antenna layer includes a first antenna region and a second antenna region spaced apart from the first antenna region. The integrated circuit die is interposed between the first antenna region and the second antenna region. The first antenna region is disposed adjacent to a first edge of the integrated circuit die, and the second antenna region is disposed adjacent to a second edge of the integrated circuit die, which is opposite to the first edge.

Anmelder

Firma

MEDIATEK INC.

Land

🇹🇼 Taiwan

Fachgebiete