Verteilte Halbleiterchip- und Gehäusearchitektur

Details

Veröffentlichungs-Nr.

EP3511980

Aktenzeichen

EP18211801

Anmeldetag

11. Dezember 2018

Veröffentlichung

19. Juni 2024

Erteilung

19. Juni 2024

Rechtsraum

EP

IPC

H01L25/065H01L25/16H01L25/18H01L25/00H01L23/538H01L23/52H01L23/498H01L23/522

Abstract

The present disclosure is directed to systems and methods of conductively coupling a plurality of relatively physically small core dies to a relatively physically larger base die using an electrical mesh network that is formed in whole or in part in, on, across, or about all or a portion of the base die. Electrical mesh networks beneficially permit the positioning of the cores in close proximity to support circuitry carried by the base die. The minimal separation between the core circuitry and the support circuitry advantageously improves communication bandwidth while reducing power consumption. Each of the cores may include functionally dedicated circuitry such as processor core circuitry, field programmable logic, memory, or graphics processing circuitry. The use of core dies beneficially and advantageously permits the use of a wide variety of cores, each having a common or similar interface to the electrical mesh network.

Anmelder

Firmen

Intel Corporation
INTEL Corporation

Land

🇺🇸 USA

Fachgebiete