Systeme und Verfahren zur On-Chip-Temperaturstabilisierung für Temperaturempfindliche Komponenten von Integrierten Schaltungen

Details

Veröffentlichungs-Nr.

EP3514960

Aktenzeichen

EP18214050

Anmeldetag

19. Dezember 2018

Veröffentlichung

23. März 2022

Erteilung

23. März 2022

Rechtsraum

EP

IPC

H03K19/003

Abstract

An integrated circuit system is provided. The system includes a ring oscillator including a first plurality of logic gates connected in a ring configuration. The system also includes a second plurality of logic gates used to implement a heater to generate a controlled amount of heat. The second plurality of logic gates is also used to implement a temperature sensor to measure a temperature of the ring oscillator. The system further includes one or more logic circuits coupled to the heater and the temperature sensor. The one or more logic circuits are used to control the heater to heat the ring oscillator only until the temperature of the ring oscillator is one of a plurality of predefined temperatures, during or after which the ring oscillator starts and operate.

Anmelder

Firma

The Boeing Company

Land

🇺🇸 USA

Fachgebiete