Verbinden von Elektronischen Bauteilen mit Montagesubstraten

Details

Veröffentlichungs-Nr.

EP3589085

Aktenzeichen

EP18305840

Anmeldetag

29. Juni 2018

Veröffentlichung

25. Oktober 2023

Erteilung

25. Oktober 2023

Rechtsraum

EP

IPC

H05K1/02H05K3/32

Abstract

<div notation="docdba" type="abstract" xml:base="/api/emi/section/388a8f1c-6bfb-4a32-a399-538102a8f686/image" xml:lang="en"><p>In a method of connecting an electronic component (1) on a mounting substrate (2) the electronic component (1) is arranged with a first surface (1a) of the electronic component facing the mounting substrate (2) and an opposite surface (1b) of the electronic component facing away from the mounting substrate. A first component-side conductor (10) on the second surface (1b) of the electronic component (1) is electrically connected to a first substrate-side conductor (22) on the mounting substrate (2) by electrically-conductive adhesive (6). The use of electrically-conductive adhesive (6) to connect the first component-side conductor (10) to the first substrate-side conductor (22) enables a reduction in the parasitic inductance that is observed when the electronic component (1) operates at high frequencies.</p></div>

Anmelder

Firma

Murata Manufacturing Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete