Verdrahtungssubstrat

Details

Veröffentlichungs-Nr.

EP3598856

Aktenzeichen

EP19187319

Anmeldetag

19. Juli 2019

Veröffentlichung

18. September 2024

Erteilung

18. September 2024

Rechtsraum

EP

IPC

H05K1/11// H05K3/46

Abstract

A wiring substrate has a substrate body formed by a single or a plurality of insulating layers and having front and back surfaces located at opposite sides of the substrate body; a plurality of pads formed on at least one of the front surface, the back surface and an inner layer surface that is located between the front and back surfaces, and having a staggered arrangement in plan view; and a plurality of via conductors formed at each of the pads, extending in a thickness direction of the substrate body with the plurality of via conductors being parallel to each other and connecting the pads located on different surfaces. Arrangement, in plan view, of the plurality of via conductors connecting to the pad and arrangement, in plan view, of the plurality of via conductors connecting to an adjacent pad located on the same surface are different from each other.

Anmelder

Firmen

Niterra Co., Ltd.
NGK SPARK PLUG CO., LTD.

Land

🇯🇵 Japan

Fachgebiete