Verfahren zum Aufbringen von Elektronischen Bauteilen

Details

Veröffentlichungs-Nr.

EP3621417

Aktenzeichen

EP18193210

Anmeldetag

7. September 2018

Veröffentlichung

11. Januar 2023

Erteilung

11. Januar 2023

Rechtsraum

EP

IPC

H05K3/30// H05K3/12

Abstract

The invention relates to a method for applying at least one electronic component to a surface. The object to provide a method for reliably applying electronic components to a surface, in particular to complex surfaces of 3D-shaped objects, for avoiding solder smearing and for increasing solder-location accuracy and reproducibility as well as allowing to obtain optical properties desirable for retrofitting applications, is solved in that the method comprises: placing a component stencil on a support, wherein the component stencil comprises at least one opening corresponding to an electronic component; arranging at least one electronic component in the corresponding opening of the component stencil; positioning a contact material stencil on the component stencil, wherein the contact material stencil comprises at least one opening corresponding to at least one contact region of the at least one electronic component; applying a contact material on the at least one contact region of the at least one electronic component arranged in the corresponding opening of the contact material stencil; and applying the at least one electronic component to the surface, wherein the contact material connects the at least one electronic component to the surface. The invention further relates to a system for use in the inventive method and an electronic device.

Anmelder

Firmen

Lumileds LLC
Lumileds Holding B.V.

Land

🇺🇸 USA

Fachgebiete