Integration von Ebg-Strukturen (einlagig/mehrlagig) zur Verbesserung der Isolation in Mehrlagiger Eingebetteter Verpackungstechnologie bei Millimeterwelle

Details

Veröffentlichungs-Nr.

EP3713013

Aktenzeichen

EP20163875

Anmeldetag

18. März 2020

Veröffentlichung

26. April 2023

Erteilung

26. April 2023

Rechtsraum

EP

IPC

H01Q1/32H01Q1/52

Abstract

A packaged radar includes laminate layers, a ground plane associated with at least one of the laminate layers, a transmit antenna and a receive antenna associated with at least one of the laminate layers, and an electromagnetic band gap structure between the transmit antenna and the receive antenna for isolating the transmit antenna and the receive antenna, the electromagnetic band gap structure including elementary cells forming adjacent columns each coupled to the ground plane, and each elementary cell including a conductive planar element and a columnar element coupled to the conductive planar element.

Anmelder

Firma

Infineon Technologies AG

Land

🇩🇪 Deutschland

Fachgebiete