Halbleiterchip

Details

Veröffentlichungs-Nr.

EP3716325

Aktenzeichen

EP20165311

Anmeldetag

24. März 2020

Veröffentlichung

26. März 2025

Erteilung

26. März 2025

Rechtsraum

EP

IPC

H01L23/525H01L23/522H02H5/04H02H3/08H01L23/62H01L23/34H10B63/10

Abstract

The present disclosure provides a semiconductor chip (1, 2, 3, 4, 5, 6) including a functional area (11, 21, 31, 41, 51, 61), a first end (12, 22, 32, 42, 52, 62), a second end (19), a third end (13, 23, 33, 43, 53, 63), and a connecting portion (14). The functional area (11, 21, 31, 41, 51, 61) has first and second sides (111, 211, 311, 411, 511, 611; 112, 212, 312, 412, 512, 612) opposite to each other. The first end (12, 22, 32, 42, 52, 62) is disposed on the first side (111, 211, 311, 411, 511, 611) and the third end (13, 23, 33, 43, 53, 63) is disposed on the first side (111, 211, 311, 411, 511, 611), wherein the semiconductor chip (1, 2, 3, 4, 5, 6) is switched on or off according to the drive signal received between the third end (13, 23, 33, 43, 53, 63) and the first end (12, 22, 32, 42, 52, 62), and the connecting portion (14) is disposed on the first side (111, 211, 311, 411, 511, 611) of the functional area (11, 21, 31, 41, 51, 61) and connected to the first end (12, 22, 32, 42, 52, 62) and the third end (13, 23, 33, 43, 53, 63), wherein when the temperature rises above the a first temperature, the connecting portion (14) is in a conductive state, so that the semiconductor chip (1, 2, 3, 4, 5, 6) is switched off due to a short circuit between the first end (12, 22, 32, 42, 52, 62) and the third end (13, 23, 33, 43, 53, 63), and when the temperature drops to be not higher than a third temperature, the connecting portion (14) is in an insulating state, wherein the first temperature is higher than or equal to the third temperature.

Anmelder

Firma

Delta Electronics (Shanghai) Co., Ltd.

Land

🇨🇳 China

Fachgebiete