Komponententräger mit Doppelschichtstruktur

Details

Veröffentlichungs-Nr.

EP3723122

Aktenzeichen

EP19168416

Anmeldetag

10. April 2019

Veröffentlichung

15. Februar 2023

Erteilung

15. Februar 2023

Rechtsraum

EP

IPC

H01L23/373H01L23/498H05K1/02H05K3/46H05K3/20H05K3/24

Abstract

The present invention relates to a double layer structure for manufacturing a component carrier (1), wherein the double layer structure is composed of: an electrically conductive patterned layer structure (2); and a further patterned layer structure (3) made of a two-dimensional material. The patterned layer structure (2) and the further patterned layer structure (3) have at least partly the same pattern. The present invention also relates to a component carrier (1), wherein the component carrier (1) comprises: a stack comprising at least one electrically conductive layer structure (4) and/or at least one electrically insulating layer structure (5); and at least one double layer structure (2, 3) connected with the stack.

Anmelder

Firma

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Land

🇦🇹 Österreich

Fachgebiete