Thermoresistive Mikrosensorvorrichtung

Details

Veröffentlichungs-Nr.

EP3751239

Aktenzeichen

EP19180341

Anmeldetag

14. Juni 2019

Veröffentlichung

2. März 2022

Erteilung

2. März 2022

Rechtsraum

EP

IPC

G01F1/692G01L9/00G01F1/684G01K7/18

Abstract

A thermoresistive micro sensor device is provided. The thermoresistive micro sensor device comprises:a semiconductor chip having an upper side and a lower side;at least one through hole, which runs through the semiconductor chip from the upper side to the lower side;one or more electrically conductive structures, wherein the middle section of each of the electrically conductive structures spans over the through hole at the upper side of the semiconductor chip;an electrically insulating arrangement configured for electrically insulating the one or more electrically conductive structures and the semiconductor chip from each other, wherein the through hole runs through the electrically insulating arrangement; anda contact arrangement comprising a plurality of contacts, wherein each of the plurality of contacts is electrically connected to one of the first end sections or to one of the second end sections, so that electrical energy, which is supplied to the contact arrangement, is fed to at least one of the electrically conductive structures in order to heat the respective electrically conductive structure, and so that an electrical resistance of one of the electrically conductive structures may be measured at the contact arrangement.

Anmelder

Firmen

Infineon Technologies AG
Technische Universität München

Land

🇩🇪 Deutschland

Fachgebiete