Stöckeler, Ferdinand
Schoppe, Zimmermann, Stöckeler
Kontaktdaten
81373 München
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Patente
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05.08.2026 · Yokogawa Test & Measurement C…
Messsystem, Endgerätevorrichtung, Programm und Messverfahren
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Status
Angemeldet am 17.11.2025
Anhängig
Vertretung
Zusammenfassung
A measurement system (1) according to the present disclosure includes a measurement device (10) and a terminal device (20). The terminal device (20) includes an authentication unit (24) that authenticates a user, and a processor (22). The processor (22) automatically acquires device information of the measurement device (10) when the terminal device (20) is connected in a wired manner to the measurement device (10) via a cable, automatically launches a control application corresponding to the device information, and lifts usage restrictions on the measurement device (10) when the authentication unit (24) authenticates the user. |
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22.07.2026 · Beijing X-Ring Technology Co., Ltd.
Verpackungsstruktur, Verpackungsverfahren, Chipstapelstruktur und Elektronische Vorrichtung
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Status
Angemeldet am 19.08.2025
Anhängig
Vertretung
Zusammenfassung
The invention relates to a packaging structure, a packaging method, a chip stacking structure and an electronic device. The packaging structure includes a first chip (1) and a second chip (2) stacked with the first chip, and the first chip has a first element (11). An active surface of the second chip is arranged opposite to an active surface of the first chip. The second chip includes a shielding element (21) arranged on one side of the second chip close to the first chip, and the shielding element is configured for reducing signal interference from the second chip to the first element. According to the packaging structure of the invention, the second chip has the shielding element, and the shielding element is arranged on the side of the second chip close to the first chip. The signal interference from the second chip to the first element may be reduced or even avoided by the usage of the shielding element, which improves a signal quality of the first element, thereby improving a signal quality of the packaging structure. |
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22.07.2026 · Daechang Seat Co., Ltd.-Dongtan
Kleidungspflegesystem für ein Fahrzeug
Fahrzeugtechnik (Automobil, Bahn & Schiff)
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Status
Angemeldet am 15.01.2026
Anhängig
Vertretung
Zusammenfassung
Proposed is a clothing care system for a vehicle that can not only store clothing easily inside a vehicle but also care for the clothing efficiently. The clothing care system for a vehicle includes a hanger including a hanger part having an inlet formed in a body and an outlet formed in legs, and a hanger coupling portion provided around the inlet, and a seat including a backrest in which a blower having a first vent formed on a rear surface and a second vent formed on a front surface is provided, and a backrest coupling portion provided around the first vent and configured to be coupled to the hanger coupling portion. |
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22.07.2026 · Daechang Seat Co., Ltd.-Dongtan
Kleidungspflegesystem für ein Fahrzeug
Fahrzeugtechnik (Automobil, Bahn & Schiff)
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Status
Angemeldet am 14.01.2026
Anhängig
Vertretung
Zusammenfassung
Proposed is a clothing care system for a vehicle that can not only store clothing easily inside a vehicle but also care for the clothing efficiently. A clothing care system for a vehicle according to an embodiment includes a seat including a backrest having a blower therein and having a vent formed on a rear surface and connected to the blower, and a magnetic coupling portion provided around the vent, and a hanger including a hanger part having an inlet formed in a body and an outlet formed in legs, and a coupling portion provided around the inlet and coupled to the magnetic coupling portion. |
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15.07.2026 · Scientech Corporation
System zur Inspektion eines Wafers
Halbleiter & Elektrische Bauelemente
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Status
Angemeldet am 18.12.2025
Anhängig
Vertretung
Zusammenfassung
A system (1) for inspecting a wafer (90) having a coating layer is provided. The system (1) includes a main body (11), an optical sensor module (13) and a processing module (14). The main body (11) defines an inspection space (110) where the wafer (90) is to be disposed. The optical sensor module (13) is mounted on the main body (11) and is configured to inspect the wafer (90) so as to obtain a sensing dataset of the wafer (90). The processing module (14) is electrically connected to the optical sensor module (13) and is configured to determine a quality of the coating layer of the wafer (90) based on the sensing dataset. |
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01.07.2026 · Autocrypt Co., Ltd.
Verfahren und System zur Beurteilung der Eignung einer Anwendungsinstallation auf Basis eines Fahrzeugsicherheitsprofils
Software & Datenverarbeitung
Nachrichtentechnik & Telekommunikation
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Status
Angemeldet am 21.10.2025
Anhängig
Vertretung
Zusammenfassung
A method of evaluating application installation suitability based on a vehicle security profile according to one embodiment of the present invention may include downloading application software to be installed in a vehicle, comparing the minimum security requirements of the application software with a vehicle security specification profile and evaluating installation suitability of the application software, and installing the application software in the vehicle when the installation suitability of the application software is approved. |
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01.07.2026 · Hitachi High-Tech Analysis Co…
Thermomechanisches Analysegerät
Mess-, Prüf- & Zeitmesstechnik
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Status
Angemeldet am 02.12.2025
Anhängig
Vertretung
Zusammenfassung
A thermomechanical analysis apparatus with improved measurement accuracy when a sample stage is used is provided. The thermomechanical analysis apparatus (1) includes a sample stage (15) where a sample (S) is placed, a sample tube (11) where the sample stage is placed, the sample tube (11) being fixed to a measurement system, a probe (10) extending in an axial direction (L), one end of the probe coming in direct or indirect contact with the sample (S) to apply a load to the sample, and a furnace (12a, 12b) configured to heat the sample, wherein the sample stage and the sample tube respectively include engaging portions (11s, 15E) that engage with each other to position the sample stage. |
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01.07.2026 · ECOPLASTIC Corporation
Direktbeleuchtung mit Lichtleiter für den Fahrzeugraum
Fahrzeugtechnik (Automobil, Bahn & Schiff)
Heiz-, Kühl- & Beleuchtungstechnik
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Status
Angemeldet am 10.03.2025
Anhängig
Vertretung
Zusammenfassung
The invention relates to a direct lighting (200) with a light guide (210) for a vehicle room, including: a light source; a light guide (210) transferring light from the light source; a housing (220) accommodating the light guide (210) therein and mounted on a vehicle internal structure (100); and a slit (110) formed in the vehicle internal structure (100), and the light guide (210) may have at least some portion inserted into the slit (110) and exposed to a front surface of the vehicle internal structure (100), and the exposed portion may be formed to directly emit light from the light source. Therefore, there is an effect of saving the manufacturing cost as the quantity of parts are reduced by integrally designing the lens and the light guide (210). |
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01.07.2026 · Penta Security Systems, Inc.
Verfahren und Vorrichtung zur Verfolgung eines Kommando-Und-Kontrollserver
Nachrichtentechnik & Telekommunikation
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Status
Angemeldet am 30.07.2025
Anhängig
Vertretung
Zusammenfassung
A method of tracking a command and control (C&C) server, which is performed by an apparatus for monitoring a process activity and a registry change of a host personal computer (PC), may comprise: storing a virtual private network (VPN) communication internet protocol (IP) when malware within the host PC attempts a VPN connection to an external server; monitoring or storing transmitted and received data between the host PC and the external server; analyzing the transmitted and received data; and registering the VPN communication IP on a blacklist when a suspicious activity is present in a result of the analysis of the transmitted and received data. |
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01.07.2026 · Hahn-Schickard-Gesellschaft f…
Verfahren zur Herstellung eines Produkts mit einer Polymerstruktur und Metallstrukturen
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Status
Angemeldet am 30.12.2024
Anhängig
Vertretung
Zusammenfassung
Method (100) of manufacturing a product, the method comprising: melting (104) a solid metal material to obtain a molten metal material; applying (108) the molten metal material onto a polymer structure deformable by applying heat and/or pressure, wherein the molten metal material solidifies upon coming into contact with the polymer structure so as to form metallic structures of customizable shape and structure; and three-dimensional deforming (112) the polymer structure including the metallic structures by providing heat and/or pressure to the polymer structure including the metallic structures so as to obtain a specific shape. |
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Vertretene Patentanmelder
Die Patentanmelder, die Stöckeler, Ferdinand in den erfassten Patenten am häufigsten vertritt.
| Anmelder | Anzahl Patente |
|---|---|
| 1. Xiaomi | 578 |
| 2. Hewlett-Packard | 388 |
| 3. Yamaha Motor | 276 |
| 4. Fraunhofer-Gesellschaft | 200 |
| 5. Murata Machinery | 189 |
| 6. Murata Manufacturing | 147 |
| 7. Hewlett Packard Enterprise (HPE) | 112 |
| 8. Infineon Technologies | 74 |
| 9. Nidec | 65 |
| 10. Yokogawa Electric | 56 |
| 11. NTT DOCOMO | 30 |
| 12. China Star Optoelectronics (CSOT) | 28 |
| 13. EntIT Software | 26 |
| 14. Volvo Construction Equipment | 26 |
| 15. Agilent Technologies | 22 |
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Fachgebiete
Kanzlei-Kollegen
Schoppe, Zimmermann, Stöckeler