Verfahren zur Herstellung von Optoelektronischer Vorrichtungen

Details

Veröffentlichungs-Nr.

EP3780123

Aktenzeichen

EP20190298

Anmeldetag

10. August 2020

Veröffentlichung

5. April 2023

Erteilung

5. April 2023

Rechtsraum

EP

IPC

H01L33/00H01L25/075H01L25/16H01L33/40// H01L27/15H01L33/22H01L33/32H01L33/44

Abstract

The present application relates to a method for manufacturing optoelectronic devices, comprising the following successive steps: a) growing, on one face of a first substrate, a stack comprising at least one semiconductor layer (123, 125, 127); b) fixing a second substrate on a face of the stack opposite the first substrate, then removing the first substrate; c) fixing a third substrate (151) on a face of the stack opposite the second substrate, then removing the second substrate; d) cutting the assembly comprising the third substrate (151) and the stack into a plurality of first chips (160) each comprising a portion of the stack; and e) fixing each first chip (160), by its face opposite the third substrate (151), on a face of a fourth semiconductor substrate (170) in and on which a plurality of integrated control circuits (171) have been previously formed.

Anmelder

Firma

Commissariat à l'Energie Atomique et aux Energies Alternatives

Land

🇫🇷 Frankreich

Fachgebiete