Verbindungen durch einen Interposer unter Verwendung von Blinden Durchkontaktierungen

Details

Veröffentlichungs-Nr.

EP3855483

Aktenzeichen

EP20305044

Anmeldetag

21. Januar 2020

Veröffentlichung

28. Juli 2021

Rechtsraum

EP

IPC

H01L23/14

Abstract

A current path is provided through an interposer (1) by exploiting an interposer substrate that has a high-resistivity portion (10a) at a first surface (10c) of the interposer and a low-resistivity portion (10b) extending from the high-resistivity portion to a second surface (10d) of the interposer. A set of blind via-holes (15) comprising electrically-conductive material (e.g. doped sidewalls) extend from the first surface (10c) of the interposer substrate through the high-resistivity portion (10a) thereof and into the low-resistivity portion (10b). Top-to-bottom connection can be made using the conductive material in the blind vias (15) and using the low-resistivity portion (10b) of the interposer substrate, while the high-resistivity portion (10a) of the interposer substrate impedes current leakage from the first surface (10c) of the substrate to the second surface (10d) of the substrate.

Anmelder

Firma

Murata Manufacturing Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete