Verfahren zur Positionierung von Komponenten auf einem Substrat

Details

Veröffentlichungs-Nr.

EP3933902

Aktenzeichen

EP20182867

Anmeldetag

29. Juni 2020

Veröffentlichung

3. Mai 2023

Erteilung

3. Mai 2023

Rechtsraum

EP

IPC

H01L21/683// H01L33/00

Abstract

A method for accurately positioning a component on a receiver substrate is provided, wherein the component is transferred from a donor substrate to a receiver substrate facing the donor substrate. The method comprises creating at least one nozzle at a predefined location in the area of contact between a blister forming layer on the donor substrate, and a component attached to the donor substrate by adhesion to the blister forming layer. The blister forming layer comprises at least a dynamic release layer, consisting of a dynamic release material, i.e. material that is vaporised when a laser beam of a given wavelength and flux density is directed to the donor substrate at the location of the component, from the back side of the donor substrate. The application of the laser beam thus creates a blister that contains vaporized dynamic release material. The blister expands until a nozzle is created, the nozzle allowing the vaporized dynamic release material to exit the blister and cause the release of the component and its propulsion towards the receiver substrate. The nozzle releases the material in the form of a narrow jet of gas, which improves the directionality of the transfer.

Anmelder

Firmen

IMEC VZW
Universiteit Gent
Imec VZW

Land

🇧🇪 Belgien

Fachgebiete