Verfahren zur Herstellung eines Laminierten Substrats, Laminiertes Substrat und Lichtemittierendes Elementsubstrat

Details

Veröffentlichungs-Nr.

EP4047420

Aktenzeichen

EP21191358

Anmeldetag

13. August 2021

Veröffentlichung

26. Juli 2023

Erteilung

26. Juli 2023

Rechtsraum

EP

IPC

G03G15/04H01L33/62// B41J2/45H01L25/16H01L27/15H01L33/00

Abstract

A method for manufacturing a laminated substrate includes removing a portion not covered with a resist layer (256) from a laminated substrate with an etchant to form a wiring (261), the laminated substrate including: a base layer including a mesa portion having a trapezoidal cross section, the mesa portion having a first inclined surface (252) extending downward and outward from a top surface and a second inclined surface (253) having an eaves-shaped portion (253a, along line 253b) protruding outward from the top surface; a wiring layer (254) formed on an upper surface of the base layer; and the resist layer (256) formed on an upper surface of the wiring layer and having a shape corresponding to a shape of the wiring (261), and the wiring is arranged at a position where the wiring covers a whole of the eaves-shaped portion (253a, along line 253b) of the second inclined surface.

Anmelder

Firma

Fujifilm Business Innovation Corp.

Land

🇯🇵 Japan

Fachgebiete