Hf-Verbindungssystem, Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4185080

Aktenzeichen

EP21209001

Anmeldetag

18. November 2021

Veröffentlichung

1. Januar 2025

Erteilung

1. Januar 2025

Rechtsraum

EP

IPC

H05K5/02H05K5/00H01R24/50

Abstract

The invention relates to an RF connection system for contacting a printed circuit board (PCB) comprises an RF connector configured to be mounted to the PCB; and a mounting element configured to be mounted between a heat sink of the PCB and the RF connector to thermally decouple the RF connector from the heat sink, wherein the mounting element comprises at least one alignment interface for aligning the RF connector with respect to the heat sink. The invention further relates to an electronic device having such an RF connection system.

Anmelder

Firma

Rohde & Schwarz GmbH & Co. KG

Land

🇩🇪 Deutschland

Fachgebiete