Isarpatent

A data request processing method for a virtual machine, an electronic device and a storage medium are provided. The method includes: determining, from log index information of a cloud disk, a target snapshot log identifier corresponding to target index information, in response to the cloud disk receiving a snapshot read request that carries the target index information corresponding to a target snapshot log and that is sent by any virtual machine among virtual machines to be started in batch, where the snapshot read request is used to request to read the target snapshot log in a snapshot copy required for starting the virtual machine, the log index information of the cloud disk is used to store a mapping relationship between a snapshot log identifier and index information, and the mapping relationship is synchronously updated based on a snapshot log identifier obtained by parsing a manifest file of the cloud disk and is used to implement data transmission between the cloud disk and each snapshot log in the snapshot copy (S501); and reading the target snapshot log in the snapshot copy by using the target snapshot log identifier, and feeding back the target snapshot log to the virtual machine (S502).

Die Erfindung betrifft ein deckenmontierbares System (1), umfassend wenigstens eine Befestigungsschiene (20) mit einem eine Längserstreckung aufweisenden ersten Profilabschnitt (21) und einem sich senkrecht zum ersten Profilabschnitt (21) erstreckenden zweiten Profilabschnitt (22); wenigstens ein Funktionselement (10) mit einer im Wesentlichen orthogonal zur Befestigungsschiene (20) ausgerichteten Längserstreckung und wenigstens einer in einer der Befestigungsschiene (20) zugewandten Seitenfläche vorgesehenen schlitzförmigen Aufnahme (12); und wenigstens ein Montageelement (30), wobei das Montageelement (30) einen formschlüssig in die schlitzförmige Aufnahme (12) einsetzbaren ersten Abschnitt und einen sich senkrecht zum ersten Abschnitt erstreckenden, relativ zum ersten Abschnitt verschiebbaren und in dem ersten Abschnitt (32) verbundenen, mit der Befestigungsschiene (20) in Eingriff bringbaren zweiten Abschnitt (34) aufweist sowie ein Verfahren zum Montieren eines deckenmontierbaren Systems (1).

A power battery system comprising: a power battery, a positive bus bar, and a negative bus bar, with a main positive switch provided in the positive bus bar and a main negative switch provided in the negative bus bar; a DC bus capacitor connected between a load side of the positive bus bar and a load side of the negative bus bar; a pre-charge line connected to the positive bus bar on the battery side and the load side of the main positive switch, the pre-charge line being provided with an adhesion detection switch, a pre-charge resistor, and a pre-charge switch; and an adhesion detection line connected between the pre-charge circuit and the negative bus bar, the adhesion detection circuit including at least one voltage divider resistor. Based on various switch states of each switch, the battery voltage on both sides of the power battery, the capacitor voltage on both sides of the DC bus capacitor, and the sampling voltage on both sides of the adhesion detection line are obtained. Based on the on/off states of each switch in various combinations of switch states, as well as the values of the capacitor voltage and the sampling voltage, the adhesion of the adhesion detection switch, the main positive switch, the main negative switch, and the pre-charge switch is determined.

The present invention relates to a composition, a vitrimer produced using such a composition, the use of such a vitrimer, as well as a method of manufacturing a vitrimer.

The present invention relates to a compound, a composition comprising one or more of such compounds, a vitrimer produced using one or more of such compounds, the use of such a vitrimer, as well as a method of manufacturing a vitrimer.

[Problem] Power electronics devices of a lower traveling body are cooled without disposing a radiator in the lower traveling body.[Solution] A working machine 100 includes a turning support part 3. The turning support part 3 turnably supports with respect to a lower traveling body 2 an upper turning body 1 disposed above the lower traveling body 2. The turning support part 3 includes a slip ring 31 and a rotary joint 32. The slip ring 31 is connected to a first electric circuit 16 of the upper turning body 1 and a second electric circuit 26 of the lower traveling body 2. The rotary joint 32 is connected to a first cooling circuit 17 of the upper turning body 1 and a second cooling circuit 27 of the lower traveling body 2.

A method for generating a layout of an engineering project (102) is disclosed. The method involves analyzing the automation code (108) to identify coding standards and creating a knowledge graph representation using an automation ontology that defines entities (104a-104n), relationships, and industry standards. The coding standards of the automation code (108) are mapped to predefined industry standards associated with the engineering project (102). An extraction code block is created and executed on the knowledge graph representation to extract entities (104a-104n). Control modules (114a-114n) are identified and created for each entity (104a-104n) based on elements of the automation code (108). A digital layout of the engineering project (102) is then generated, defining the entities (104a-104n), control modules (114a-114n), and their relationships. This method enables automatic layout generation directly from the automation code (108), facilitating efficient upgrades to brownfield engineering projects (102).

The present invention relates to a monomer, a vitrimer produced using one or more of such monomers, the use of such a vitrimer, as well as a method of manufacturing a vitrimer.

A semiconductor package according to embodiments of the present disclosure includes a package substrate; a redistribution substrate bonded to the package substrate by a first bump, and including a dielectric layer and redistribution patterns; a first underfill layer filled in the space between the package substrate and the redistribution substrate; a semiconductor chip bonded to the redistribution substrate by a second bump; and a first molding layer disposed on the redistribution substrate, and surrounding the semiconductor chip, wherein the dielectric layer includes a negative tone dielectric layer that includes polyimide at a mass ratio of 50% or more.

The present invention provides a method for manufacturing comprising depositing a mask layer on a first surface on a front side of a substrate, wherein the mask layer has at least one opening mark; depositing an intermediate layer on the mask layer; bonding a first oxide layer on the intermediate layer; depositing a stress compensation layer on a second surface on a back side of the substrate, wherein at least one of a material and a thickness of the stress compensation layer are selected for reducing a bow of the substrate; depositing a waveguide structure on the first oxide layer, wherein the waveguide structure has a core layer and a cladding layer, wherein the core layer has a predetermined width and a predetermined thickness and is aligned with the opening mark; and anisotropic etching of a V-groove into the substrate at the opening marker of the mask layer such that when a fiber having a predetermined size is placed inside the V-groove, a core of the fiber is centered with respect to the core layer of the waveguide structure. Further, the present invention provides a corresponding fiber-waveguide coupler, a further method for manufacturing a fiber-waveguide coupler as well as a corresponding further fiber-waveguide coupler.