Dünnes Substratgehäuse und Leiterrahmen

Details

Veröffentlichungs-Nr.

EP4293716

Aktenzeichen

EP23178319

Anmeldetag

9. Juni 2023

Veröffentlichung

20. Dezember 2023

Rechtsraum

EP

IPC

H01L23/495H01L21/56H01L23/00

Abstract

The present disclosure is directed to a thin substrate package and a lead frame method of fabricating the semiconductor package (100). The semiconductor package includes a first lead frame portion (109) and a second lead frame portion (104). A substrate (102) is positioned in a center opening (118) between the first lead frame portion and the second lead frame portion, the substrate having a thickness less than or equal to 0.10-millimeters (mm). A first die (110) having a plurality of wires is positioned on the substrate by an adhesive (108). A molding compound (116) covers the first and second lead frame portions, the substrate, and the first die.

Anmelder

Firma

STMicroelectronics, Inc.

Land

🇵🇭 PH

Fachgebiete