Leistungsrahmengehäuse mit Reduzierten Löthohlräumen

Details

Veröffentlichungs-Nr.

EP4345891

Aktenzeichen

EP23198385

Anmeldetag

19. September 2023

Veröffentlichung

3. September 2025

Erteilung

3. September 2025

Rechtsraum

EP

IPC

H01L23/495H01L23/31

Abstract

An electronic device includes an integrated circuit (IC) with its second face bonded to a first surface of a first support. A conductive clip has a first portion that is elongate and extends across the IC, having its second surface bonded to a first face of the IC by a solder layer. A second portion of the clip extends from the first portion away from the IC toward a second support with the second surface bonded to a first surface of the second support. A first surface of the clip has a pattern formed therein including a depressed floor with fins extending upwardly therefrom. Through-holes extend through the depressed floor to the second surface of the clip. An encapsulating layer covers portions of the first and second supports, IC, and clip while leaving the first surface of the first portion exposed to permit heat to radiate away therefrom.

Anmelder

Firma

STMicroelectronics, Inc.

Land

🇵🇭 PH

Fachgebiete