Verfahren zur Herstellung einer Vorrichtung mit Zwei Halbleiterchips und So Erhaltene Vorrichtung

Details

Veröffentlichungs-Nr.

EP4361091

Aktenzeichen

EP23203161

Anmeldetag

12. Oktober 2023

Veröffentlichung

26. November 2025

Erteilung

26. November 2025

Rechtsraum

EP

IPC

B81C1/00

Abstract

Device formed by a first die (210) and a second die (221). The first die is of semiconductor and integrates electronic components (202). The second die has a main surface (210A), forms patterned structures (230) and is bonded to the first die. Internal electrical coupling structures (242) electrically couple the main surface (210A) of the first die (210) to the second die (221). External connection regions (241) extend on the main surface of the first die (210). A package (246) embeds the first die (210), the second die (221) and the internal electrical coupling structures (242) and partially surrounds the external connection regions (241), the external connection regions partially protruding from the package. The second die (221) has through recesses (207, 208) accommodating external connection regions

Anmelder

Firma

STMicroelectronics S.r.l.

Land

🇮🇹 Italien