Verfahren zur Überwachung der Thermischen Impedanz von Leistungsmodulen

Details

Veröffentlichungs-Nr.

EP4390349

Aktenzeichen

EP22306944

Anmeldetag

19. Dezember 2022

Veröffentlichung

29. Oktober 2025

Erteilung

29. Oktober 2025

Rechtsraum

EP

IPC

G01K7/42H02M1/32H02M7/5387

Abstract

Thermal impedance monitoring process for a power module of a power converter used for transforming DC current to AC current, or vice-versa, where the semiconductor dissipates an asymmetrical loss between two half cycles of an AC frequency f of the AC current, said power module comprising at least a semiconductor die attached to a material stack-up of layers for its thermal dissipation and/or electrical connections, said process comprising: - sampling and measuring a signal relating to the junction temperature Tj of said semiconductor die at a frequency higher than twice said AC frequency of said AC current, - calculating a time duration Δt= tTjmax- tTjmin between a moment tTjmax, where said junction temperature of said semiconductor die is at a maximum value, and a moment tTjmin, where said junction temperature is at a minimum value, in one period of said AC current, and storing said time duration Δt in a memory, - repeating said sampling and measuring said signal and said calculating said time duration at different times tx=t0 to tm during the operating life of the power module to provide a series of time durations Δt<t0> to Δt<tm> and comparing said time durations Δt<t0> to Δt<tm> values for monitoring an evolution of said time duration Δt to determine an evolution of degradation of the thermal impedance of said power module.

Anmelder

Firmen

Mitsubishi Electric R&D Centre Europe B.V.
MITSUBISHI ELECTRIC CORPORATION

Land

🇳🇱 Niederlande

Fachgebiete