Mikroelektronisches Bauelement mit Kombinierter Stromversorgung und Kühlung von der Rückseite

Details

Veröffentlichungs-Nr.

EP4391049

Aktenzeichen

EP22216219

Anmeldetag

22. Dezember 2022

Veröffentlichung

28. Mai 2025

Erteilung

28. Mai 2025

Rechtsraum

EP

IPC

H01L23/528// H01L23/48H01L23/535H01L23/473

Abstract

A micro-electronic component (1) according to the invention, for example an integrated circuit chip (1), comprises a front-end-of-line (FEOL) portion and a back-end-of-line (BEOL) portion at its front side. A back side power delivery network (PDN) is furthermore present at the back side of the component, with via connections (49) connecting the PDN to the FEOL and BEOL portions. The back side PDN is different from prior art designs, in that it comprises a 'dry part' and a 'wet part' : the dry part includes multiple interconnect levels of the PDN embedded in a dielectric material (57), as known in the art. The 'wet part' comprises the remaining PDN levels which are however not embedded in a dielectric but which are part of a manifold structure configured to receive therein a flow of cooling fluid in order to remove heat generated by the devices in the FEOL portion.

Anmelder

Firma

Imec VZW

Land

🇧🇪 Belgien

Fachgebiete