Verfahren zum Schweissen von Substraten und Geschweisste Substrate

Details

Veröffentlichungs-Nr.

EP4393869

Aktenzeichen

EP22216975

Anmeldetag

28. Dezember 2022

Veröffentlichung

3. Juli 2024

Rechtsraum

EP

IPC

B81B7/00B81C1/00// B23K26/20

Abstract

The invention relates to a method for welding substrates comprising: bringing a first substrate and a second substrate in contact with each other such that a contact area between the two substrates is formed; introducing at least two outer weld lines extending next to each other within the contact area into the first and second substrates such that the first and second substrates are welded together by each of the outer weld lines and such that a dicing area is defined between the two outer weld lines; and introducing one or more inner weld lines extending between the two outer weld lines within the dicing area into at least one of the two substrates. The invention further relates to welded substrates and to singulated chips, in particular hermetically sealed enclosures.

Anmelder

Firmen

SCHOTT AG
SCHOTT Primoceler Oy

Land

🇩🇪 Deutschland

Fachgebiete