Mechanische Ermüdungsüberwachung für Leistungsmodulverpackung

Details

Veröffentlichungs-Nr.

EP4403871

Aktenzeichen

EP23305074

Anmeldetag

23. Januar 2023

Veröffentlichung

17. September 2025

Erteilung

17. September 2025

Rechtsraum

EP

IPC

G01B7/16G01L1/22G01M5/00H05K1/02

Abstract

Power module comprising a PCB comprising at least two outer layers (11, 12) provided with metallic tracks (13, 14, 15), comprising a core layer (16) embedding one or more power semiconductor dies (17) and comprising one or more deformation sensing elements (20, 21, 22) embedded in said PCB to sense a mechanical stress in at least one axis in a three dimension coordinate system attached to the PCB. Process for measuring stress on such a power module PCB comprising an initial measurement of a deformation D<0> of the PCB in use during a calibration period (100) with said strain gauges to provide a calibration of an initial deformation range of said PCB, in use measurements (110) of deformation cycles Cy of said PCB and counting (120) of said deformation cycles, repeating (150) said in use measurements during operation of said power module.

Anmelder

Firmen

Mitsubishi Electric R&D Centre Europe B.V.
MITSUBISHI ELECTRIC CORPORATION

Land

🇳🇱 Niederlande

Fachgebiete