Thermisch Verbesserte Substratstruktur und Verpackungsanordnung der Selbigen

Details

Veröffentlichungs-Nr.

EP4429413

Aktenzeichen

EP24162136

Anmeldetag

7. März 2024

Veröffentlichung

10. Dezember 2025

Erteilung

10. Dezember 2025

Rechtsraum

EP

IPC

H05K1/02H05K1/11

Abstract

A substrate structure and a package assembly with the substrate structure are provided. The substrate structure includes a first trace, a second trace, a first through-hole via (THV), a second THV formed in a build-up layer and a bridge trace. The first trace includes a first pad portion and a second pad portion separated from the first pad portion and arranged near a corner of the first pad portion. The first THV passes through the first pad portion and the second THV passes through the second pad portion. The first bridge trace formed in the substrate structure and thermally connected to the second THV and the first THV.

Anmelder

Firmen

MEDIATEK INC.
MediaTek Inc.

Land

🇹🇼 Taiwan

Fachgebiete