Substratverarbeitungsvorrichtung und Substratverarbeitungsverfahren

Details

Veröffentlichungs-Nr.

EP4432335

Aktenzeichen

EP24161276

Anmeldetag

4. März 2024

Veröffentlichung

6. November 2024

Rechtsraum

EP

IPC

H01L21/67H01L21/677H01L21/68

Abstract

An upper surface of a substrate that is carried into a substrate processing apparatus includes a valid area in which a circuit pattern is formed or to be formed and an invalid area. In a substrate rotator, an image of the substrate is picked up, so that the invalid area is identified. Based on invalid area information and information in regard to an abnormal film-thickness portion that is predicted in advance, a portion in which an abnormal film-thickness portion can be arranged in the invalid area is extracted. A rotation position of the substrate is adjusted such that an extracted portion in the invalid area is located in one end portion in a moving direction of a slit nozzle during a coating process. The substrate the rotation position of which is adjusted by the substrate rotator is transferred to a coating processor by a receiver-transferer.

Anmelder

Firma

SCREEN Holdings Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete