Kilian Kilian & Partner mbB

A substrate processing apparatus includes three processing casings stacked in a vertical direction. Each of the three processing casings includes, in an internal space, a spin chuck, an ejection unit, a cup that receives a coating liquid scattered from a substrate held by the spin chuck, a cup drainage flow path that is formed to extend vertically downward from the cup and that discharges the coating liquid received by the cup, a casing drainage flow path formed to extend in the vertical direction, and a connection flow path that connects a lower end of the cup drainage flow path and the casing drainage flow path. The respective casing drainage flow paths of the three processing casings are connected as the three processing casings are stacked in the vertical direction.

A substrate processing apparatus including: a batch processing block (7) for performing a batch process; a first orientation conversion mechanism (71) capable of converting substrates having been subjected to the batch process, from a vertical orientation to a horizontal orientation; a standby bath (55) where the substrates having been converted into the horizontal orientation are kept on standby; a lifting mechanism for performing an exposing operation of bringing one of the substrates kept on standby in the standby bath (55), the one being one substrate at a time, to a space above the standby bath (55); a center robot capable of carrying the substrates in the space above the standby bath (55) to outside; and a single-wafer processing block (8) including a single-wafer processing chamber (48) where the single-wafer process is performed to the substrates in the horizontal orientation, and the center robot (CR) carries the substrates from the space above the standby bath (55) into the single-wafer processing chamber (48).

A first head for ejecting first ink and a second head for ejecting second ink are arranged in order from an upstream side along a transport path for a base material. A surface-tensiondifference regulator executes regulation processing for changing a dynamic-surface-tension characteristic of at least one ink. In a case where the time when first ink droplets land on a target position of the base material is given as a first time, the time when second ink droplets land on the target position is given as a second time, and an absolute value of a difference between the dynamic surface tensions of the first ink droplets and the second ink droplets at the second time is given as a first-and-second ink surface tension difference, the first-and-second ink surface tension difference when the regulation processing is executed is smaller than that when the regulation processing is not executed.

Die Erfindung betrifft eine Vorrichtung zur Überwachung eines Vorgangs, in dem ein pulver-/granulatförmiges Produkt zwischen einem Behälter und einer Einrichtung überführt wird, wobei die Vorrichtung aufweist: eine Sensoranordnung, die bestimmungsgemäß in Bezug auf die Einrichtung installiert wird, wobei die Sensoreinrichtung eingerichtet ist, Partikel, insbesondere Staubpartikel, zu detektieren und auf Basis eines entsprechenden Detektionsergebnisses zu ermitteln, ob das pulver-/granulatförmige Produkt bei der Überführung in eine Umgebung der Einrichtung ausgetreten ist.

An image display device (1) comprising: an image generation unit (10) that emits a light flux forming a predetermined image as a parallel light flux; and a light guide (20) that propagates the parallel light flux internally, the light guide (20) having a light flux introduction unit (23) into which the parallel light flux emitted from the image generation unit is introduced, a propagation unit that propagates the introduced parallel light flux while totally reflecting it internally, and a light extraction unit that extracts a part of the parallel light flux propagated through the propagation unit by a beam splitter (22), wherein the beam splitter is one in which reflective portions (222) that reflect the parallel light flux are formed in a two-dimensional arrangement.

A substrate processing apparatus includes a nozzle device having a liquid discharger, a fluid supply system that supplies a processing liquid having a surface tension lower than that of a residual liquid to the nozzle device, a horizontal-direction driving device that moves the nozzle device to a plurality of different portions in a radial direction of a substrate in plan view while keeping the nozzle device at a position above the rotating substrate, and a controller that controls the fluid supply system and the horizontal-direction driving device according to a liquid processing condition. A liquid processing condition includes a liquid flow-rate condition that defines a flow rate of a processing liquid to be supplied to the nozzle device in each of the plurality of portions of the substrate, and a liquid movement condition that defines a movement speed of the nozzle device when the nozzle device moves to each of the plurality of portions of the substrate in order to supply the processing liquid to each of the plurality of portions of the substrate.

A brush device is attachable to and detachable from a brush holder. The brush holder is moved by a movement device. A brush of the brush device is pressed against an upper surface of a substrate held by a substrate holding device, and the substrate is cleaned. In a substrate cleaning device, with one brush device attached to the brush holder, another brush device is stored in a brush storage device. The brush holder is moved by a movement device to the brush storage device after an old brush device is detached. Another brush device is attached to the brush holder. The movement device includes an arm rotation driver and an arm movement driver that move the brush holder in two respective different directions.

A substrate processing method includes: a holding step of carrying a substrate into an inside of a chamber and holding said substrate; a supply step of supplying a fluid to the substrate on the inside of the chamber; an imaging step (S12) of sequentially imaging the inside of the chamber by a camera to acquire image data; a condition setting step (S11) of specifying a monitoring target from a plurality of monitoring target candidates in the chamber and changing an image condition based on the monitoring target; and a monitoring step (S13) of performing a monitoring process on the monitoring target based on the image data having the image condition corresponding to the monitoring target.

A substrate processing apparatus collectively processes a plurality of substrates with the plurality of substrates immersing in a processing liquid. The substrate processing apparatus includes a processing tank, a camera, and a controller. The processing tank stores the processing liquid. The camera is provided vertically higher above the processing tank and captures the inside of the processing tank to generate a plurality of items of captured image data. The controller generates smoothed image data obtained by smoothing a brightness distribution of waving caused on a liquid surface of the processing liquid based on integration of the plurality of items of captured image data, and monitors the inside of the processing tank based on the smoothed image data.

A temperature measurement wafer (1) includes a temperature sensor (3), a transmission unit (8), and a battery substrate (7). The transmission unit (8) wirelessly transmits temperature data of a temperature measurement subject measured by the temperature sensor (3) to the temperature measurement wafer (1). That is, the temperature measurement wafer (1) wirelessly transmits information to the outside, a decrease in operation efficiency caused by a communication wire can be avoided. The battery substrate (7) supplies power to each of the temperature sensor (3) and the transmission unit (8) using an all-solid-state secondary battery (21). Using the all-solid-state secondary battery (21) makes it possible to operate the temperature measurement wafer (1) without deteriorating its performance even under a higher temperature condition. Thus, the temperature measurement wafer (1) can be used under a higher temperature condition while improving the operation efficiency of the temperature measurement wafer (1).