Kilian Kilian & Partner mbB

A substrate processing apparatus includes a processing unit and a transporter. The transporter includes an end effector including a first hand and a second hand and a hand movement driver moving the end effector in a horizontal direction. The first elevating driver moves the first support member to each of a first processing height position where a first direct contact part of the first support member having contact with a lower surface of the substrate is located above the first hand, a second processing height position where the first direct contact part is located between the first hand and the second hand, and a third processing height position where the first direct contact part is located below the second hand.

A monitoring region is set by efficient processing, and the presence or absence of an anomaly related to an operational state of a monitoring target article is monitored efficiently. A processor of a substrate treatment apparatus sets a monitoring region three-dimensionally based on three-dimensional design information pertaining to the substrate treatment apparatus, generates a normal image for each of timings during a normal operation carried out based on a recipe by two-dimensionalizing the monitoring region in a view from a placement position, and stores the normal image in a normal image storage unit before performing an actual treatment on the substrate. Further, during working in which the substrate is actually treated based on the recipe, the processor detects an anomaly on the basis of a difference between the normal image and the real image captured by the camera, which are synchronized with the operation based on the recipe.

In an etching method in accordance with the present invention, ultraviolet rays are irradiated to an etching solution. As a result, OH radicals are generated in the etching solution. Then, etching of a to-be-etched film is performed by the etching solution containing the OH radicals. Accordingly, it becomes possible to efficiently etch the to-be-etched film by using an etching solution on a substrate on which the to-be-etched film is formed to be adjacent to an insulating film.

A processing liquid is supplied to a substrate by a processing nozzle. A processing image showing the substrate to which the processing liquid is supplied is generated by an imaging device. An input image receiver receives a first input image showing a state of the processing liquid on the substrate when an abnormality occurs in a substrate process. Based on the first input image, a shape model generator generates a shape model representing a three-dimensional shape of the processing liquid supplied to the substrate. A simulation executor simulates a transition of a state of the processing liquid in the shape model. An image generator generates an image showing a transition of the state of the processing liquid in a simulation. A collector collects the generated image as an abnormal image. An abnormality detector detects an abnormality in the substrate process based on a comparison between the processing image and the abnormal image.

An electrolytic sulfuric acid supply apparatus includes a generation tank, a temperature control circulation pipe, and an electrolytic circulation pipe. The temperature control circulation pipe includes a common circulation pipe and a temperature control separate pipe. The electrolytic circulation pipe includes the common circulation pipe and an electrolytic separate pipe. A liquid feeder, a heater, and a first temperature sensor are arranged in the common circulation pipe. A temperature control circulation valve is disposed in the temperature control separate pipe. A filter, a cooler, an electrolytic cell, and a second temperature sensor are arranged in the electrolytic separate pipe. The electrolytic cell is disposed downstream of the cooler, and the second temperature sensor is disposed between the cooler and the electrolytic cell.

An electrolytic sulfuric acid supply apparatus includes a collection tank (TK1), a generation tank (TK2), a bidirectional pipe (71), a bidirectional first liquid feeder (72), an electrolytic circulator (6), a water supply (3), and a drain (4). The bidirectional pipe connects the collection tank and the generation tank. The first liquid feeder is disposed in the bidirectional pipe. The electrolytic circulator includes an electrolytic circulation pipe (61) connected to the generation tank and an electrolytic cell (65) disposed in the electrolytic circulation pipe. The water supply includes a water supply pipe (31) supplying water to the collection tank and a water supply valve (32). The drain includes a first drainage pipe (41) connected to the collection tank, a first drainage valve (42), a second drainage pipe (43) connected to the generation tank, and a second drainage valve (44).

Data that is used for retraining of a trained model is appropriately selected. A support apparatus is an apparatus for supporting retraining of a trained model constructed in a false report filter that determines appropriateness of defect determination for an image which has been determined by a defect inspection apparatus to have a defect and that filters a false report, the support apparatus tagging correct answer information, correctness information, and category information to a defect data set in which a determination result from the false report filter is tagged to each of a plurality of sets of image data that have been determined to have a defect, and displaying the defect data set on a display.

Realized is a measurement that accommodates diverse repeating patterns of an object to be measured. A measurement apparatus (1) includes: a first light receiving head (22) which receives first reflected light that is first inspection light having been projected from vertically above and reflected by a sample (100); a second light receiving head (32) which receives second reflected light that is second inspection light having been projected from obliquely above and reflected by the sample; and a processor (60), the first light receiving head having a first shutter (23) capable of adjusting an amount of the first reflected light received, the second light receiving head having a second shutter (33) capable of adjusting an amount of the second reflected light received, and the processor controlling an opening and closing amount of each of the first shutter and the second shutter.

A method of processing a substrate W includes: holding the substrate W; and dispensing a processing liquid from a plurality of outlets of an elongated nozzle toward a main surface of the substrate W while the substrate W is rotated and the elongated nozzle is moved along a longitudinal direction, the elongated nozzle extending along the longitudinal direction, the plurality of outlets being aligned along the longitudinal direction.

The present invention relates to a substrate processing method and a substrate processing apparatus. The substrate processing method includes a treating step, a replacing step, and a pressure restoration step. In the treating step, a treating gas is supplied to a treatment space. The treatment space accommodates a substrate. In the replacing step, a pressure in the treatment space is kept lower than atmospheric pressure. In the replacing step, an inert gas is supplied to the treatment space. In the replacing step, a gaseous body is exhausted from the treatment space. In the pressure restoration step, the pressure in the treatment space returns to the atmospheric pressure. A flow rate of the inert gas supplied to the treatment space is a supply flow rate. A flow rate of the gaseous body exhausted from the treatment space is an exhaust flow rate. In the replacing step, at least either the supply flow rate or the exhaust flow rate changes with time.