Halbleiteranordnung

Details

Veröffentlichungs-Nr.

EP4435851

Aktenzeichen

EP24163968

Anmeldetag

15. März 2024

Veröffentlichung

16. Oktober 2024

Rechtsraum

EP

IPC

H01L23/373H01L23/42// H01L23/367

Abstract

A semiconductor device is provided. The semiconductor device includes a substrate, a semiconductor die, a lid, a liquid metal, a gel and a thermal dissipation structure. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate and covers the semiconductor die. The lid has an opening to expose the semiconductor die. The liquid metal is disposed on the semiconductor die. The gel is disposed between the semiconductor die and the lid. The thermal dissipation structure is disposed on the lid and covers the opening. The semiconductor die, the gel and the thermal dissipation structure form a closed space for accommodating the liquid metal.

Anmelder

Firma

MediaTek Inc.

Land

🇹🇼 Taiwan

Fachgebiete