Vorrichtung zum Formen von Elektronischen Packungen, Formverfahren und damit Hergestellte Elektronische Packung

Details

Veröffentlichungs-Nr.

EP4462469

Aktenzeichen

EP24172325

Anmeldetag

25. April 2024

Veröffentlichung

4. Juni 2025

Rechtsraum

EP

IPC

H01L21/56B29C43/00B29C43/18B29C43/52B29L31/34B29L31/00

Abstract

The present invention relates to an electronic package molding device, a molding method, and an electronic package manufactured using the same, and more specifically, to an electronic package molding device using a planar heating element, a molding method, and an electronic package manufactured using the same. The electronic package molding device according to one embodiment of the present invention includes a planar heating element configured to mold an electronic package by approaching one surface of an electronic package to melt a molding agent disposed on the one surface of the electronic package and apply pressure to bring the epoxy molding compound into close contact with the electronic package and a gas pressure regulator configured to adjust gas pressure between the electronic package and the planar heating element.

Anmelder

Firma

Korea Advanced Institute of Science and Technology

Land

🇰🇷 Südkorea

Fachgebiete