Massenproduktionsprüfung für Träger-In-Paket mit Bordwellenleiter
Anmelder: NXP B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP4471433
- Aktenzeichen
- EP24173080
- Anmeldetag
- 29. April 2024
- Veröffentlichung
- 25. Februar 2026
- Erteilung
- 25. Februar 2026
- Rechtsraum
- EP
- IPC
- G01R1/04G01R31/28G01R31/302
Abstract
A two-stage test process for testing IC packages having integrated launchers includes a first stage in which an RF-accurate test process is used to perform RF-accurate tests on a sample set of IC packages to obtain RF-accurate test results and a loop-back test process is performed to obtain loop-back test results. Test characterization data is obtained by comparing the RF-accurate test results to the loop-back test results. In a second stage, larger-scale testing is performed solely with the loop-back test process, and the loop-back test results for each tested IC package are compared with the test characterization data to characterize the test operation of the tested IC package. The loop-back test process can employ a test jig employing a PCB-mounted or PCB-integrated loop-back structure for relatively rapid test setup and test processing.
Anmelder
- Firma
- NXP B.V.
- Land
- 🇳🇱 Niederlande
Niederländischer Halbleiterhersteller mit Sitz in Eindhoven. Entwickelt Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation, Sicherheit sowie industrielle Anwendungen.
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