Lasermikrodissektionssystem, Teleskopischer Abstandsring und Verfahren zur Lasermikrodissektion

Details

Veröffentlichungs-Nr.

EP4528246

Aktenzeichen

EP23198102

Anmeldetag

19. September 2023

Veröffentlichung

26. März 2025

Rechtsraum

EP

IPC

G01N1/28G02B21/32G02B21/02G02B21/24G01N1/04

Abstract

A laser microdissection system (100, 200) comprises a stage (110) configured to receive a sample (104) to be cut and a collection unit (108) comprising at least one well (106) arranged below the sample (104), the well (106) being arranged and configured to capture a dissectate (102) cut from the sample (104). The laser dissection system further comprises an objective nosepiece (112) mounting two or more objectives (114a, 114b, 204) that can be alternately pivoted into the optical axis (O) of the laser microdissection system (100, 200) for at least cutting and/or observing the sample (104). At least one of the objectives (114a, 114b, 204) is configured as a long working distance objective (114a, 204) having a working distance (WD) greater than or equal to the depth of the well (106) with a depth of at least 11.2 mm and at most 42 mm, and is configured such that the other objectives (114b) mounted by the objective nosepiece (112) do not collide with the sample (104), the collection unit (108) and/or the stage (110), when a bottom of the well (106) is in focus of the long working distance objective (114a, 204).

Anmelder

Firma

Leica Microsystems CMS GmbH

Land

🇩🇪 Deutschland

Fachgebiete