Selektive Schichtübertragung

Details

Veröffentlichungs-Nr.

EP4528792

Aktenzeichen

EP24195635

Anmeldetag

21. August 2024

Veröffentlichung

9. Juli 2025

Rechtsraum

EP

IPC

H01L21/56H01L21/683H01L25/065// H01L21/67H01L25/10

Abstract

Methods of selectively transferring portions of layers between substrates, and devices and systems formed using the same, are disclosed herein. In one embodiment, a first substrate with a layer of integrated circuit (IC) components is received, and a second substrate with one or more adhesive areas is received. The first substrate is partially bonded to the second substrate, such that a subset of IC components on the first substrate are bonded to the adhesive areas on the second substrate. The first substrate is then separated from the second substrate, and the subset of IC components bonded to the second substrate are separated from the first substrate and remain on the second substrate.

Anmelder

Firma

Intel Corporation

Land

🇺🇸 USA

Fachgebiete