Verfahren und Vorrichtung zur Behandlung von Substraten

Details

Veröffentlichungs-Nr.

EP4528795

Aktenzeichen

EP24200234

Anmeldetag

13. September 2024

Veröffentlichung

26. März 2025

Rechtsraum

EP

IPC

H10P72/00

Abstract

A coating nozzle discharging a coating solution is moved to an upper side of a notch as a notched part of the substrate held in a stationary state. The substrate is rotated only once in a horizontal plane while the coating solution is discharged from the coating nozzle to form a coating film on an upper surface of a peripheral edge part of the substrate. The coating nozzle retracts when the coating nozzle is located on the upper side of the notch again. Application of the coating solution is started from the notch of the substrate, and is finished at the notch, thus the coating solution is applied only once to the peripheral edge part of the substrate, and the coating film with a narrow width can be formed. Overlapping of the coating solution does not occur in the notch, thus the coating film with a uniform width can be formed.

Anmelder

Firma

SCREEN Holdings Co., Ltd.

Land

🇯🇵 Japan

Fachgebiete