Optisches Sensormodul

Details

Veröffentlichungs-Nr.

EP4546007

Aktenzeichen

EP24207604

Anmeldetag

18. Oktober 2024

Veröffentlichung

30. April 2025

Rechtsraum

EP

IPC

G01S7/481H05K9/00H05K1/18H05K3/28

Abstract

The present disclosure relates to an optical sensor module (200) comprising: - a substrate (102) comprising first conductive pads (106); - a module cap (130) assembled on the substrate; - a connecting flex (230) incorporated in the module cap, the connecting flex being adapted to electrically couple at least one of the first conductive pads (106) to at least one component (152) mounted on and/or inside the module cap; the connecting flex comprising at least one metal layer covered by, or encapsulated in, at least one dielectric layer.

Anmelder

Firma

STMicroelectronics International N.V.

Land

🇨🇭 Schweiz

Fachgebiete