Vergossenes Leistungsgehäuse mit Vertikaler Verbindung

Details

Veröffentlichungs-Nr.

EP4546399

Aktenzeichen

EP23206097

Anmeldetag

26. Oktober 2023

Veröffentlichung

30. April 2025

Rechtsraum

EP

IPC

H01L21/48H01L23/31H01L23/495

Abstract

A molded power package includes a laser-activatable mold compound having a plurality of laser-activated regions which are plated with an electrically conductive material to form metal pads and/or metal traces at a first side of the laser-activatable mold compound. The package further includes a semiconductor power die embedded in the laser-activatable mold compound and having a plurality of bond pads and a bond pad interconnect electrically connecting the plurality of bond pads of the semiconductor power die to the metal pads and/or metal traces at the first side of the laser-activatable mold compound. A leadframe includes a carrier section on which the semiconductor power die is mounted and a carrier interconnect section integral with the carrier section. The carrier interconnect section electrically connects the carrier section to the metal pads and/or metal traces at the first side of the laser-activatable mold compound. An upper surface of the carrier interconnect section is at a height that is elevated relative to an upper surface of the carrier section.

Anmelder

Firma

Infineon Technologies Austria AG

Land

🇦🇹 Österreich

Fachgebiete