Elektromagnetische Abschirmung für Halbleitergehäuse ohne Hervorstehende Anschlüsse

Details

Veröffentlichungs-Nr.

EP4579741

Aktenzeichen

EP24220853

Anmeldetag

18. Dezember 2024

Veröffentlichung

2. Juli 2025

Rechtsraum

EP

IPC

H01L23/552H01L23/495H01L21/48H01L21/56

Abstract

Structures and methods for full-enclosure electromagnetic shielding of leadless semiconductor packages provide complete module-level electromagnetic shielding by combining plated shielding with proposed modified leadframe peripheral structure and ground pad grounding. A first cut into an overmolded leadless module exposes the peripheral ring of the leadframe; then, with controlled metal plating a full shielding enclosure is formed over the top of the package into contact with the exposed peripheral ring. The proposed approach provides complete electromagnetic shielding for the module with significantly improved electromagnetic shielding performance. The full enclosure shielding solution is especially important for high frequency and high-speed application and sensing products with high sensitivity to electromagnetic interference.

Anmelder

Firma

NXP USA, Inc.

Land

🇺🇸 USA

Fachgebiete