Integrierte Schaltungsstruktur mit Vorderseitig Geschnittenem Rückseiten-Source- oder Drainkontakt
Anmelder: Intel Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4580345
- Aktenzeichen
- EP24220377
- Anmeldetag
- 16. Dezember 2024
- Veröffentlichung
- 2. Juli 2025
- Rechtsraum
- EP
- IPC
- H10D84/01H10D30/01H10D30/43H10D30/00H10D84/83
Abstract
Integrated circuit structures having front-side-cut backside source or drain contacts are described. In an example, an integrated circuit structure includes a first gate stack over a first plurality of horizontally stacked nanowires or fin, and a second gate stack over a second plurality of horizontally stacked nanowires or fin. A first epitaxial source or drain structure is at an end of the first plurality of horizontally stacked nanowires or fin, the first epitaxial source or drain structure having a backside contact structure thereon. A second epitaxial source or drain structure is at an end of the second plurality of horizontally stacked nanowires or fin, the second epitaxial source or drain structure having a backside dielectric structure thereon, the backside dielectric structure laterally spaced apart from the backside contact structure. A dielectric gate cut plug is laterally between and in contact with the backside dielectric structure and the backside contact structure.
Anmelder
- Firma
- Intel Corporation
- Land
- 🇺🇸 USA
US-amerikanischer Halbleiterhersteller mit Sitz in Kalifornien. Entwickelt und produziert Prozessoren, Chipsätze sowie weitere Halbleiterkomponenten für Computer, Server und eingebettete Systeme.
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