Platzierung von Leistungsschaltvorrichtungen auf Durchgangslöchern durch Pads

Details

Veröffentlichungs-Nr.

EP4601421

Aktenzeichen

EP25156563

Anmeldetag

7. Februar 2025

Veröffentlichung

13. August 2025

Rechtsraum

EP

IPC

H05K1/18H05B6/12// H05K1/02

Abstract

A printed circuit board (10) includes a substrate (16) extending in first and second lateral directions (18, 20) between respective sides (22, 24) of a perimeter (26) defined between first and second faces (28, 30). A DC bus capacitor (32) is electrically connected to a DC BUS (31) and is mounted on the first face (28) of the substrate (16). At least one resonant load capacitor (34) is mounted on the first face (28) of the substrate (16). At least one surface mount transistor (36) is mounted on the second face (30) of the substrate (16) and electrically connected with the DC bus capacitor (32) and the resonant load capacitor (34) through the substrate (16).

Anmelder

Firma

Whirlpool Corporation

Land

🇺🇸 USA

Fachgebiete