Defektidentifizierung und -Segmentierung ohne Markierte Daten und Bildqualitätsverbesserung

Details

Veröffentlichungs-Nr.

EP4607460

Aktenzeichen

EP25171538

Anmeldetag

21. April 2025

Veröffentlichung

22. Oktober 2025

Rechtsraum

EP

IPC

G06T7/00G06T7/11

Abstract

An apparatus for identifying defects on a wafer under inspection includes a memory storing a set of instructions and at least one processor configured to execute the set of instructions to cause the apparatus to perform: operations including: acquiring a set of labeled images, wherein the set of labeled images includes: a first set of images generated by a generative model trained on input images, a conditioning mask, and conditioning parameters, wherein the conditioning mask and the conditioning parameters are associated with a defect; the input images; and the conditioning mask; and training a segmentation model, using the set of labeled images, to predict the defect in a second set of images.

Anmelder

Firma

ASML Netherlands B.V.

Land

🇳🇱 Niederlande

Fachgebiete