Luftlager für Waferfoliendehnung
Anmelder: Nexperia B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP4611026
- Aktenzeichen
- EP24159970
- Anmeldetag
- 27. Februar 2024
- Veröffentlichung
- 3. September 2025
- Rechtsraum
- EP
- IPC
- H01L21/67
Abstract
Aspects of the present disclosure relate to a method for stretching a wafer foil that is held by a film frame carrier and on which a plurality of electronic components is arranged. Aspects of the present disclosure further relate to a method for transferring an electronic component. Further aspects of the present disclosure further relate to a device for stretching a wafer foil that is held by a film frame carrier and on which a plurality of electronic components is arranged, and to a pick- and-place apparatus for transferring an electronic component. For stretching the wafer foil, the film frame carrier is tensioned over a tensioning member by mutually moving the tensioning member and the film frame carrier. According to an aspect of the present disclosure, an air bearing is generated in between the wafer foil and the tensioning member at least during a part of the mutual movement of the film frame carrier and the tensioning member.
Anmelder
- Firma
- Nexperia B.V.
- Land
- 🇳🇱 Niederlande
Der Anmelder ist ein niederländischer Halbleiterhersteller mit Sitz in Nijmegen, der als Ausgründung aus NXP Semiconductors hervorging. Das Patentportfolio konzentriert sich stark auf Halbleiter- und Elektrobauelemente, ergänzt durch Elektronik, Schaltungstechnik und elektrische Energietechnik. Anmeldungen laufen seit 2009 durchgehend fort.
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